undefined

IEC 61189-2-809 2024 Test methods for electrical materials circuit boards and other interconnection structures and assemblies Part 2-809 X-Y coefficient of thermal expansion (CTE) test for thick base

文档预览

中文文档 22 页 50 下载 1000 浏览 10 评论 3 收藏 4.0分

点我下载
仅需2元下载(无需注册)

温馨提示：本文档共22页，可预览 3 页，如浏览全部内容或当前文档出现乱码,可直接付费下载原始文档

IEC 61189-2-809 2024 Test methods for electrical materials circuit boards and other interconnection structures and assemblies Part 2-809 X-Y coefficient of thermal expansion (CTE) test for thick base 第 1 页

IEC 61189-2-809 2024 Test methods for electrical materials circuit boards and other interconnection structures and assemblies Part 2-809 X-Y coefficient of thermal expansion (CTE) test for thick base 第 2 页

IEC 61189-2-809 2024 Test methods for electrical materials circuit boards and other interconnection structures and assemblies Part 2-809 X-Y coefficient of thermal expansion (CTE) test for thick base 第 3 页

下载文档到电脑，方便使用

赞助2元下载

本文档由路人甲于 2025-03-24 23:34:05上传分享

举报

下载原文档(7.45 MB)

分享

友情链接

站内资源均来自网友分享或网络收集整理，若无意中侵犯到您的权利，敬请联系我们，我们将及时删除相关资源。