论文标题
HPK $ n^+$ - $ P $ PLANAR像素传感器的评估CMS-2阶段升级
Evaluation of HPK $n^+$-$p$ planar pixel sensors for the CMS Phase-2 upgrade
论文作者
论文摘要
为了应对计划在2029年开始操作的大型强子对撞机（HL-LHC）计划的高光度升级的挑战性环境，CMS将取代其整个跟踪系统。跟踪器的要求在很大程度上取决于10年的长时间运行时间，瞬时峰值光度为$ 7.5 \ times 10^{34} $ cm $^{ - 2} $ s $ s $ s $^{ - 1} $在最终性能方案中。根据距相互作用点的径向距离，硅传感器将接收到对应于非电离能量损失的粒子通量，最多$φ_ {\ text {eq}} = 3.5 \ times 10^{16} $ cm $ cm $^{ - 2} $。本文着重于平面像素传感器的设计和资格，直至$φ_ {\ text {eq}} = 1.4 \ times 10^{16} $ cm $ $^{ - 2} $的通知。 For the development of appropriate planar pixel sensors an R\&D program was initiated, which includes $n^+$-$p$ sensors on 150 mm (6'') wafers with an active thickness of 150 $μm$ with pixel sizes of $100\times 25$ $μm^2$ and $50\times 50$ $μm^2$ manufactured by Hamamatsu.制作了带有ROC4SES和RD53A读数芯片的单芯片模块。对质子和中子的辐照也是DESY进行的广泛测试束运动。本文介绍了主要使用ROC4SENS读数芯片对各种组件进行调查。它表明，多种设计在故障电压，泄漏电流和效率方面满足了要求。 $ 50 \ times 50 $ $μm^2 $像素的单点分辨率为4.0 $μm$的非辐射样品，辐照至$φ_ {\ text {eq}} = 7.2 = 7.2 \ times 10^\ times 10^{15} $ cm $ cm $ cm $^} $ 6.3 $μm$。
To cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), scheduled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are largely determined by the long operation time of 10 years with an instantaneous peak luminosity of up to $7.5\times 10^{34}$ cm$^{-2}$s$^{-1}$ in the ultimate performance scenario. Depending on the radial distance from the interaction point, the silicon sensors will receive a particle fluence corresponding to a non-ionizing energy loss of up to $Φ_{\text{eq}} = 3.5\times 10^{16}$ cm$^{-2}$ . This paper focuses on planar pixel sensor design and qualification up to a fluence of $Φ_{\text{eq}} = 1.4\times 10^{16}$ cm$^{-2}$. For the development of appropriate planar pixel sensors an R\&D program was initiated, which includes $n^+$-$p$ sensors on 150 mm (6'') wafers with an active thickness of 150 $μm$ with pixel sizes of $100\times 25$ $μm^2$ and $50\times 50$ $μm^2$ manufactured by Hamamatsu. Single chip modules with ROC4Sens and RD53A readout chips were made. Irradiation with protons and neutrons, as well was an extensive test beam campaign at DESY were carried out. This paper presents the investigation of various assemblies mainly with ROC4Sens readout chips. It demonstrates that multiple designs fulfill the requirements in terms of breakdown voltage, leakage current and efficiency. The single point resolution for $50\times 50$ $μm^2$ pixels is measured as 4.0 $μm$ for non-irradiated samples, and 6.3 $μm$ after irradiation to $Φ_{\text{eq}} = 7.2\times 10^{15}$ cm$^{-2}$.
