论文标题
量子技术大规模集成的超导路线平台
Superconducting routing platform for large-scale integration of quantum technologies
论文作者
论文摘要
为了达到大规模量子计算，可扩展量子阵列及其在多芯片组件中的控制电子的三维整合是有希望的。在这些组件中，使用超导互连作为路由层，就（1）（1）热管理提供了有趣的视角，以保护量子器免受控制电子的自热性，（2）被动设备性能，具有显着的质量因素和（3）低频率和高频信号的质量增长，因此，高频率信号的最低限度相关。我们使用200毫米硅晶片技术报告了该制造的多层路由平台，该平台旨在杂交自旋量子量和控制电子芯片。路由级别通过AL0.995CU0.005的一层将Qubits和对照电路耦合，并通过基于W的VIAS连接了TIN，NB或NBN的超导层。 300 K处的晶圆级参数测试验证了这些技术的产量，而低温测量低温测量用于提取路由层的超导性能。提出了嵌入在这些路由水平的超导被动元件的初步低温射频特征。
To reach large-scale quantum computing, three-dimensional integration of scalable qubit arrays and their control electronics in multi-chip assemblies is promising. Within these assemblies, the use of superconducting interconnections, as routing layers, offers interesting perspective in terms of (1) thermal management to protect the qubits from control electronics self-heating, (2) passive device performance with significant increase of quality factors and (3) density rise of low and high frequency signals thanks to minimal dispersion. We report on the fabrication, using 200 mm silicon wafer technologies, of a multi-layer routing platform designed for the hybridization of spin qubit and control electronics chips. A routing level couples the qubits and the control circuits through one layer of Al0.995Cu0.005 and superconducting layers of TiN, Nb or NbN, connected between them by W-based vias. Wafer-level parametric tests at 300 K validate the yield of these technologies and low temperature electrical measurements in cryostat are used to extract the superconducting properties of the routing layers. Preliminary low temperature radio-frequency characterizations of superconducting passive elements, embedded in these routing levels, are presented.
