论文标题
RD50-MPW2 HV-CMOS像素芯片的读数系统和测试灯结果
Readout system and testbeam results of the RD50-MPW2 HV-CMOS pixel chip
论文作者
论文摘要
RD50-CMOS组旨在设计和研究高压CMOS（HVCMOS）芯片，以在高辐射环境中使用。当前，测量是在RD50-MPW2芯片上进行的，这是该组开发的第二个原型。原型的活动矩阵由具有模拟前端的8x8像素组成。模拟前端和模拟的细节已经发布。这项贡献着重于活跃矩阵的基于驯鹿的读数系统。活动矩阵的每个像素都可以彼此读取。引入了硬件，固件和软件的相关方面。作为第一阶段，引入了独立设置的固件，并提供了数据流的详细信息。之后，提出了能够与其他探测器同步和接受触发器的固件的第二阶段，重点是将芯片的操作与跟踪望远镜结合使用以测量效率和残差。
The RD50-CMOS group aims to design and study High Voltage CMOS (HVCMOS) chips for use in a high radiation environment. Currently, measurements are performed on RD50-MPW2 chip, the second prototype developed by this group. The active matrix of the prototype consists of 8x8 pixels with analog front end. Details of the analog front end and simulations have been already published earlier. This contribution focuses on the Caribou based readout system of the active matrix. Each pixel of the active matrix can be readout one after the other. Relevant aspects of hardware, firmware and software are introduced. As a first stage, firmware for a standalone setup is introduced and details on data flow are given. Afterwards, a second stage of the firmware capable of synchronizing with other detectors and accepting triggers is presented, focusing on operation of the chip in combination with a tracking telescope to measure efficiency and residuals.
