论文标题
包装增强的光纤芯片互连与放大的光栅耦合器和多模纤维
Packaging-enhanced optical fiber-chip interconnect with enlarged grating coupler and multimode fiber
论文作者
论文摘要
光学I/O在实验室片系统的寿命中起着至关重要的作用，从初步测试到目标环境中的操作。但是，由于所需的精确对齐，有效且可靠的芯片连接仍然具有挑战性，从而产生不一致的测试结果和不稳定的包装性能。为了克服此问题，为了在单个模式片上系统中使用，我们建议将与多模纤维结合使用的面积增强的光栅耦合器合并。与带有单模光纤的传统小区域光栅耦合器相比，这种组合可以更简单，更快，更可靠的连接。在这项工作中，我们在实验上证明了对于大面积构型的3DB内平面（x，y）空间耐受性为（10.2μm，17.3μm），至少（2.49，3.33）小面积的面积（2.49，3.33）倍于小面积的面积，并且与理论计算很好地达成一致。这个简单的概念很容易适用于一系列的光子系统，在这些系统系统中，需要更便宜的光学I/O。
Optical I/O plays a crucial role in the lifespan of lab-on-a-chip systems, from preliminary testing to operation in the target environment. However, due to the precise alignments required, efficient and reliable fiber-to-chip connections remain challenging, yielding inconsistent test results and unstable packaged performance. To overcome this issue, for use in single mode on-chip systems, we propose the incorporation of area-enlarged grating couplers working in conjunction with multimode fibers. This combination enables simpler, faster, and more reliable connections than the traditional small area grating coupler with single-mode fiber. In this work, we experimentally demonstrate a 3dB in-plane (X, Y) spatial tolerance of (10.2 μm, 17.3 μm) for the large area configuration, being at least (2.49, 3.33) times that of the small area one, and agreeing well with theoretical calculations. The simple concept is readily applicable to a range of photonic systems where cheaper more robust optical I/O is desired.
