论文标题
用于超导量子处理器的微波包装设计
Microwave Package Design for Superconducting Quantum Processors
论文作者
论文摘要
在微波制度中具有过渡频率的固态Qub（例如超导量子）处于量子信息处理的最前沿。然而，即使是中等程度的高保真，同时控制超导量子位仍然是一个挑战，部分原因是包装这些设备的复杂性。在这里，我们提出了一种用于材料选择，信号线工程和虚假模式抑制的微波包装设计的方法。我们描述了使用用于开发24端口微波包装的模拟和测量结果验证的设计指南。分析Qubit环境没有发现高达11GHz的虚假模式。材料和几何设计选择使包装能够支撑寿命超过350μs的量子。这里介绍的微波包装设计指南涉及与近期量子处理器相关的许多问题。
Solid-state qubits with transition frequencies in the microwave regime, such as superconducting qubits, are at the forefront of quantum information processing. However, high-fidelity, simultaneous control of superconducting qubits at even a moderate scale remains a challenge, partly due to the complexities of packaging these devices. Here, we present an approach to microwave package design focusing on material choices, signal line engineering, and spurious mode suppression. We describe design guidelines validated using simulations and measurements used to develop a 24-port microwave package. Analyzing the qubit environment reveals no spurious modes up to 11GHz. The material and geometric design choices enable the package to support qubits with lifetimes exceeding 350 μs. The microwave package design guidelines presented here address many issues relevant for near-term quantum processors.
