论文标题
使用嵌入式通道对3D-IS的液体冷却的数值分析
Numerical Analysis of Liquid Cooling of 3D-ICs Using Embedded Channels
论文作者
论文摘要
热点被认为是3D-ICS高积分密度的不可避免的后果之一。消除热点需要采用有效的冷却技术。使用嵌入式通道，可以设计液体冷却系统，以将适量的冷却液传递到芯片的每个位置。在这项研究中，数值分析用于研究使用三个冷却剂的嵌入式通道对20 W热点的冷却：水，弗莱恩（R22）和液氮（LN）。对热管理和压力的研究表明，尽管LN提供了最低的工作温度（164 K），但在100 mm/s的入口速度下会导致最高应力（355 MPa）。该研究还表明，使用平行通道的冷却液递送会导致局部温度和应力的广泛变化。这种应力变化可能形成高应力斑点，这可能会导致电路故障，性能降解或降低屈服。因此，应设计冷却系统和芯片制造，以确保消除高压力热点。
Hot-spots are considered among the unavoidable consequences of the high integration density of 3D-ICs. Eliminating hot spots requires employing efficient cooling techniques. Using embedded channels, liquid cooling systems can be designed to deliver the right amount of coolant to each spot of the chip. In this study, numerical analysis is used to investigate the cooling of a 20 W hot spot using embedded channels employing three coolants: water, Freon (R22), and liquid nitrogen (LN). The investigation of thermal management and stress show that, although LN provides the lowest operating temperature (164 K), it causes the highest stress (355 MPa) at 100 mm/s inlet velocity. The study also shows that, coolant delivery using parallel channels results in a wide variation of local temperatures and stress. This stress variation may form high-stress spots, which may cause circuit failure, performance degradation, or yield reduction. Therefore, cooling systems and chip fabrication should be designed to ensure the elimination of high-stress hot spots.
