论文标题
高熵合金作为高级电子包装的非常低的熔点焊料
A high entropy alloy as very low melting point solder for advanced electronic packaging
论文作者
论文摘要
研究了基于SNBIINZN的高熵合金（HEA），作为低回流温度焊料，熔点约为80 oC。在100 oC的回流10分钟后，润湿角约为52O。界面界面间化合物（IMC）生长动力学被测量为具有低活化能的成熟控制，大约18.0 kJ/mol，但是，界面反应速率非常慢，导致IMC层的形成。低熔点HEA焊料在高级电子包装技术中具有潜在的应用，尤其是对于生物医学设备。
SnBiInZn based high entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 oC. The wetting angle is about 52o after reflow at 100 oC for 10 min. The interfacial intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol, however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for bio-medical devices.
