论文标题

cavo的多层工程$ _3 $薄膜与srtio $ _3 $和laalo $ _3 $ dft+dmft

Multilayer engineering of CaVO$_3$ thin films with SrTiO$_3$ and LaAlO$_3$ from DFT+DMFT

论文作者

Beck, Sophie, Ederer, Claude

论文摘要

在本文中,我们使用密度函数理论与动态平均场理论(DFT+DMFT)相结合,研究相关金属Cavo $ _3 $的薄膜与两种典型的基板材料SRTIO $ _3 $和LAALO $ $ _3 $之间的界面效应。我们发现,Cavo $ _3 $/srtio $ _3 $接口对Cavo $ _3 $薄膜的影响只有边际影响,主要的效果是(散装的)表达不匹配而受到的(散装)的表达不匹配,这是由于增强的孔隙层造成的cavo $ _3 $ sptergutting在增强的水平上,因此t $ _ {\ mathrm {2G}} $ orbitals。相比之下,在Polar Cavo $ _3 $/LAALO $ _3 $接口处,界面的存在可能会对薄膜属性产生巨大影响,这既取决于特定的接口终端以及多层几何形状施加的特定边界条件。我们比较了三种不同的方法,以建模相关的金属cavo $ _3 $与带绝缘子Laalo $ _3 $之间的接口,这些方法都在电子结构上施加了不同的(静电)边界条件。从我们的计算中获得的光谱特性揭示了超细胞几何形状的强烈影响,从散装到高度掺杂和结构扭曲的相位,表明通过多层工程具有界面特性的潜在可调性。

In this paper we use density functional theory combined with dynamical mean-field theory (DFT+DMFT) to study interface effects between thin films of the correlated metal CaVO$_3$ and the two typical substrate materials SrTiO$_3$ and LaAlO$_3$. We find that the CaVO$_3$/SrTiO$_3$ interface has only a marginal influence on the CaVO$_3$ thin film, with the dominant effect being the (bulklike) epitaxial strain imposed by the large lattice mismatch, rendering the CaVO$_3$ film insulating due to the enhanced orbital polarization related to the strong level splitting between the t$_{\mathrm{2g}}$ orbitals. In contrast, at the polar CaVO$_3$/LaAlO$_3$ interface, the presence of the interface can have a huge effect on the thin film properties, depending both on the specific interface termination as well as the specific boundary conditions imposed by the multilayer geometry. We compare three different approaches to model the interface between the correlated metal CaVO$_3$ and the band insulator LaAlO$_3$, which all impose a different set of (electrostatic) boundary conditions on the electronic structure. The spectral properties obtained from our calculations reveal a strong influence of the supercell geometry, ranging from bulklike to highly doped and structurally distorted phases, indicating a potential tunability of the interfacial properties via multilayer engineering.

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