论文标题

(0001)alpha-al2O3的等值型cocrfeni膜的微结构演化和热稳定性

Microstructure evolution and thermal stability of equiatomic CoCrFeNi films on (0001)alpha-Al2O3

论文作者

Addab, Younes, Kini, Maya K., Courtois, Blandine, Savan, Alan, Ludwig, Alfred, Bozzolo, Nathalie, Scheu, Christina, Dehm, Gerhard, Chatain, Dominique

论文摘要

均匀的面部中心立方(FCC)多晶型薄膜在室温下沉积在(0001)alpha-al2O3(C-Sapphire)上。在973 K和1423 K之间研究了200至670 nm厚的膜的相位和形态稳定性。FCC期持续存在,而原始的<111> 30-100 nm宽的柱状晶粒的质地演变为〜10或〜1000微米宽晶粒。只有与蓝宝石具有特定定向关系的谷物生长; as in the case of pure fcc metal (M) films 4 orientation relationships (OR) are found: OR1 (M(111)[1-10]//alpha-Al2O3 (0001)[1-100]) and OR2 (M(111)[1-10]//alpha-Al2O3 (0001)[11-20]) and their twin-related variants (OR1t and OR2t).在1000 K以下,薄膜微结构稳定成10微米宽的OR1和OR1T双晶粒,独立于膜厚度。 OR2和OR2T晶粒在1000 K以上,尺寸超过膜厚度的1000倍以上。退火后,这些胶片要么保留其完整性,要么取决于谷物生长和谷物边界槽的竞争动力学。跟踪了晶粒边界的三连杆,即电影稳定性的主要参与者。较薄的膜和较高的温度通过从三重连接处的孔中脱水到基板,这有利于薄膜分裂。 OR2和OR2T晶粒的晶界足够快地迁移,以克服破裂可以引发的孔的成核。在同等同源退火温度下,该复合金合金中OR2和OR2T晶粒的生长速度比纯FCC金属的生长速度快。

Homogeneous face-centered cubic (fcc) polycrystalline CoCrFeNi films were deposited at room temperature on (0001)alpha-Al2O3 (c-sapphire). Phase and morphological stability of 200 to 670 nm thick films were investigated between 973 K and 1423 K. The fcc-phase persists while the original <111> texture of 30-100 nm wide columnar grains evolves into ~10 or ~1000 micron wide grains. Only the grains having specific orientation relationships to the sapphire grow; as in the case of pure fcc metal (M) films 4 orientation relationships (OR) are found: OR1 (M(111)[1-10]//alpha-Al2O3 (0001)[1-100]) and OR2 (M(111)[1-10]//alpha-Al2O3 (0001)[11-20]) and their twin-related variants (OR1t and OR2t). Below 1000 K, the film microstructure stabilizes into 10 micron wide OR1 and OR1t twin grains independent of film thickness. Above 1000 K, the OR2 and OR2t grains expand to sizes exceeding more than a 1000 times the film thickness. Upon annealing, the films either retain their integrity or break-up depending on the competing kinetics of grain growth and grain boundary grooving. Triple junctions of the grain boundaries, the major actors in film stability, were tracked. Thinner films and higher temperatures favor film break-up by dewetting from the holes grooved at the triple junctions down to the substrate. The grain boundaries of the OR2 and OR2t grains migrate fast enough to overcome the nucleation of holes from which break-up could initiate. The growth of the OR2 and OR2t grains in this complex alloy is faster than in pure fcc metals at equivalent homologous annealing temperatures.

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