论文标题
晶圆键的表面等离子体波导生物传感器具有平面微流体界面
Wafer-Bonded Surface Plasmon Waveguide Biosensors with In-Plane Microfluidic Interfaces
论文作者
论文摘要
利用远程表面等离子体偏振子(LRSPP)的生物传感器由嵌入细胞机中的AU条纹组成的波导制造并证明了整合和封装的微流体通道。设计了一种制造方法,其中在Si基板上制造了下部覆层和嵌入式AU条纹,并在玻璃基板上制造了上覆层和微流体通道,然后进行晶圆粘合,将晶圆粘合到完整的结构中。该键以光路的全长为中心,但无法观察到光学散射或过量损失的证据,并且无法从高磁化横截面图像中辨别出粘合界面的证据。我们还展示了平面微流体入口和出口的晶状体制造,以及用于流体边缘耦合的固定装置,可为外部流体管和组件提供密封的接口。平面微流体界面在晶圆切割时自动定义沿碎屑面定义,从而排除了在盖子中钻孔的需求。通过测量LRSPPS对完全覆盖的参考波导的衰减,通过微流体通道的波导以及测量传感器对通过注入各种传感溶液产生的折射率变化的响应来评估芯片的性能。我们基于晶圆粘合和面内流体接口的制造方法对低成本的高量制造业令人信服。
Biosensors exploiting long-range surface plasmon polariton (LRSPP) waveguides comprised of Au stripes embedded in Cytop with integrated and encapsulated microfluidic channels are fabricated and demonstrated. A fabrication approach was devised where the lower cladding and recessed Au stripes are fabricated on a Si substrate, and the upper cladding and microfluidic channels are fabricated on a glass substrate, followed by wafer bonding to assemble the wafers into complete structures. The bond is centered over the full length of the optical path, yet no evidence of optical scattering or excess loss due to the bond could be observed, and no evidence of a bonding interface could be discerned from high-magnification cross-sectional images. We also demonstrate wafer-scale fabrication of in-plane microfluidic inlets and outlets, along with a fixture for fluidic edge coupling that provides sealed interfaces to external fluidic tubing and components. In-plane microfluidic interfaces are automatically defined along chip facets upon wafer dicing, precluding the need to drill through holes in lids. The performance of the chips was assessed by measuring the attenuation of LRSPPs on fully cladded reference waveguides, on waveguides passing through microfluidic channels, and by measuring the response of sensors to changes in refractive index produced by injecting various sensing solutions. Our fabrication approach based on wafer bonding and in-plane fluidic interfacing is compelling for low-cost high-volume manufacturing.